BASE METALS AND ARTICLES OF BASE METAL > COPPER AND ARTICLES THEREOF > Copper foil (whether or not printed or backed with paper, paperboard, plastics or similar backing materials) of a thickness (excluding any backing) not exceeding 0,15|mm
| Code | Description | Duty |
|---|---|---|
| 7410110000 | Not backed | 5.200 % |
| 7410110000 | Of refined copper | 5.200 % |
| 7410110050D | Refined copper foil and strips, electrolytically manufactured, with a thickness of 0,015 mm or more but not more than 0,150 mm, used for the manufacture of laminates for Printed Circuit Boards and of Printed Circuit Boards in the printed circuit board industry | 5.200 % |
| 7410110090D | Other | 5.200 % |
| 7410120000D | Of copper alloys | 5.200 % |
+11 sub-codes
| Other |
| 5.200 % |
| 7410120000D | Of copper alloys | 5.200 % |
| 7410210000 | Backed | 5.200 % |
| 7410210000 | Of refined copper | 5.200 % |
| 7410210010D | Sheet or plate of polytetrafluoroethylene, containing aluminium oxide or titanium dioxide as filler or reinforced with glass-fibre fabric, covered on both sides with copper foil | 5.200 % |
| 7410210020D | Foils, rolls composed of one layer of glass epoxy of 100|µm colaminated with refined copper foil on one or two sides of 35|µm with a tolerance of 10|% for use in the production of smart cards | 5.200 % |
| 7410210030D | Film of polyimide, whether or not containing epoxide resin and/or glass fibre, covered on one side or on both sides with a copper foil | 5.200 % |
| 7410210040D | Sheet or plates: -|consisting of at least a central layer of paper or one central sheet of any type of nonwoven fibre, laminated on each side with glass-fibre fabric and impregnated with epoxide resin, or -|consisting of multiple layers of paper, impregnated with phenolic resin, coated on one or both sides with a copper film with a maximum thickness of 0,15|mm | 5.200 % |
| 7410210050D | Plates: -consisting of at least one layer of fibreglass fabric impregnated with thermosetting resin, -covered on one or both sides with copper foil with a thickness of not more than 0,15 mm, and -with a dielectric constant (DK) of less than 3,9 and a loss factor (Df) of less than 0,015 at a measuring frequency of 10 GHz, as measured according to IPC-TM-650 | 5.200 % |
| 7410210055D | Plates: - consisting of at least one layer of fibreglass fabric impregnated with epoxide resin, - covered on one or both sides with copper foil with a thickness of not more than 0,15 mm, - with a dielectric constant (DK) of less than 5,4 at 1 MHz, as measured according to IPC-TM-650 2.5.5.2, - with a loss tangent of less than 0,035 at 1 MHz, as measured according to IPC-TM-650 2.5.5.2, - with a comparative tracking index (CTI) of 600 or more | 5.200 % |
| 7410210065D | Sheets or Plates -consisting of at least one layer of fiberglass fabric impregnated with modified epoxy resin, without the use of halogenated flame retardants, -covered on one or both sides with copper foil with a thickness of 0,15 mm or less, -and with a TG of 145°C or more but not more than 280°C according to TMA, in agreement with IPC-4101/128 or 4101/130 or IPC-4101/153 or 4101/154 | 5.200 % |
| 7410210090D | Other | 5.200 % |
| 7410220000D | Of copper alloys | 5.200 % |