MACHINERY AND MECHANICAL APPLIANCES > ELECTRICAL MACHINERY AND EQUIPMENT AND PARTS THEREOF; SOUND RECORDERS AND REPRODUCERS, TELEVISION IMAGE AND SOUND RECORDERS AND REPRODUCERS, AND PARTS AND ACCESSORIES OF SUCH ARTICLES > Semiconductor devices (for example, diodes, transistors, semiconductor-based transducers); photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED), whether or not assembled with other light-emitting diodes (LED); mounted piezo-electric crystals > Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes (LED) > Light-emitting diodes (LED)
Product samples
47Sample products
Synonyms
LED, light-emitting diode, LED device
Keywords
LED · light-emitting diode · LED device · Semiconductor device · assembled with other light-emitting diodes
This chapter does not cover: electrically warmed blankets, bed pads, etc. (heading 6301), glass of heading 7011 or 7014, furniture of Chapter 94, or toys/games of Chapter 95. Note 2 (Parts): Parts suitable for use solely or principally with a particular kind of article are classified with that article; parts equally suitable for two or more articles of this chapter are classified in heading 8538 or 8548. Heading 8523 covers all media for the recording of sound or other phenomena, including unrecorded media, and also covers recorded media such as software, data, sound recordings, and digital content regardless of whether the recording is permanent or temporary. Heading 8542 covers monolithic integrated circuits (MICs), hybrid integrated circuits (HICs), and electronic microassemblies. Printed circuit assemblies consisting of one or more printed circuits of heading 8534 with mounted components are classified in heading 8534 if they do not form a complete article, otherwise they follow the relevant heading for the complete article.
1. This Section does not cover: (a) transmission or conveyor belts or belting of plastics of Chapter 39, or of vulcanised rubber (heading 4010), or other articles of vulcanised rubber other than hard rubber, for technical uses (heading 4016); (b) articles of leather or of composition leather (heading 4205) or of furskin (heading 4303), of a kind used in machinery or mechanical appliances or for other technical uses; (c) bobbins, spools, cops, cones, cores, reels or similar supports, of any material (for example, Chapter 39, 40, 44 or Section XV); (d) perforated cards for Jacquard or similar machines (for example, Chapter 39 or 48 or Section XV); (e) transmission or conveyor belts or belting of textile material (heading 5910) or other articles of textile material for technical uses (heading 5911); (f) precious or semi-precious stones (natural, synthetic or reconstructed) of headings 7102 to 7104, or articles wholly of such stones of heading 7116, except unmounted worked sapphires and diamonds for styli (heading 8522); (g) parts of general use, as defined in Note 2 to Section XV, of base metal (Section XV) or similar goods of plastics (Chapter 39); (h) drill pipe (heading 7304); (ij) endless bands of metal wire or strip (Section XV); (k) articles of Chapter 82 or 83; (l) articles of Section XVII; (m) articles of Chapter 90; (n) clocks, watches or other articles of Chapter 91; (o) interchangeable tools of heading 8207 or brushes of a kind used as parts of machines (heading 9603); similar interchangeable tools are to be classified according to the constituent material of their working part; (p) articles of Chapter 95; (q) typewriter or similar ribbons, whether or not on spools or in cartridges (heading 9612), or monopods, bipods, tripods and similar articles of heading 9620. 2. Subject to Note 1 to this Section, Note 1 to Chapter 84 and Note 1 to Chapter 85, parts of machines (not being parts of the articles of heading 8484, 8544, 8545, 8546 or 8547) are to be classified according to the following rules: (a) parts which are goods included in any of the headings of Chapter 84 or 85 (other than headings 8409, 8431, 8448, 8466, 8473, 8487, 8503, 8522, 8529, 8538 and 8548) are in all cases to be classified in their respective headings; (b) other parts, if suitable for use solely or principally with a particular kind of machine, or with a number of machines of the same heading, are to be classified with the machines of that kind or in heading 8409, 8431, 8448, 8466, 8473, 8503, 8522, 8529 or 8538 as appropriate; however, parts which are equally suitable for use principally with the goods of headings 8517 and 8525 to 8528 are to be classified in heading 8517; (c) all other parts are to be classified in heading 8409, 8431, 8448, 8466, 8473, 8503, 8522, 8529 or 8538 as appropriate or, failing that, in heading 8487 or 8548. 3. Unless the context otherwise requires, composite machines consisting of two or more machines fitted together to form a whole and other machines designed for the purpose of performing two or more complementary or alternative functions are to be classified as if consisting only of that component or as being that machine which performs the principal function. 4. Where a machine (including a combination of machines) consists of individual components (whether separate or interconnected by piping, by transmission devices, by electric cables or by other devices) intended to contribute together to a clearly defined function covered by one of the headings in Chapter 84 or Chapter 85, then the whole is to be classified in the heading appropriate to that function. 5. For the purposes of these Notes, the expression 'machine' means any machine, machinery, plant, equipment, apparatus or appliance cited in the headings of Chapter 84 or 85.
Source: European Commission - CN Explanatory Notes (CNEN) and HS legal notes.
€0
€0
€0
€310.07/kg
€449.92/kg
3,090
ConcentratedThird-country sourcing partners
| # | Partner | Value (EUR) | kg | €/kg | Share | YoY |
|---|---|---|---|---|---|---|
| 1 | 🇨🇳 China | €2.0B | 11.6Mt | €171.74/kg | 44.7% | |
| 2 | 🇲🇾 Malaysia | €1.1B | 752Kt | €1.5K/kg | 25.4% | |
| 3 | 🇯🇵 Japan | €908.4M | 500Kt | €1.8K/kg | 20.3% | |
| 4 | 🇹🇼 Taiwan | €221.0M | 330Kt | €670.38/kg | 4.9% | |
| 5 | 🇺🇸 United States | €155.4M | 137Kt | €1.1K/kg | 3.5% | |
| 6 | 🇻🇳 Vietnam | €54.0M | 83Kt | €651.53/kg | 1.2% |
Third-country target markets
| # | Partner | Value (EUR) | kg | €/kg | Share | YoY |
|---|---|---|---|---|---|---|
| 1 | 🇨🇳 China | €628.9M | 160Kt | €3.9K/kg | 36.4% | |
| 2 | 🇲🇾 Malaysia | €576.8M | 181Kt | €3.2K/kg | 33.4% | |
| 3 | 🇺🇸 United States | €207.1M | 310Kt | €667.98/kg | 12.0% | |
| 4 | 🇹🇷 Turkey | €161.2M | 474Kt | €340.10/kg | 9.3% | |
| 5 | 🇬🇧 United Kingdom | €154.9M | 1.2Mt | €134.07/kg | 9.0% |
1037/2014
Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.
1037/2014
Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.
1037/2014
Groups of semiconductor components dedicated to LED lighting, designed for various professional and domestic applications: LED Module: compact plastic casing (7 × 7 × 5 mm) incorporating an LED chip mounted in parallel with a Zener diode, to be assembled on a surface-mounted circuit board (SMC). Intended for specialized electronic lighting (flash, automotive, signaling, etc.). LED Module on a PCB with metallic core: similar LED module soldered onto a printed circuit board serving as a heat sink (21 mm diameter), with soldering pads for electrical connection, intended for integration into high-performance final lighting systems. LED Assembly: casing (6 × 5 × 1 mm) containing four separate LED chips, each associated with a Zener diode, with back contacts for surface-mounting integration, intended for lighting in entertainment, architecture, or ambiance. LED Panel: circular assembly (49 mm diameter) of 156 interconnected LED chips in series/parallel, housed in a plastic casing with heat sink and screw fixation, designed for general or professional lighting (retrofit, commercial, road lighting, etc.). These components, physically inseparable, fall under semiconductor devices with electroluminescent diodes (HS 8541), subject to CE marking (RoHS, electrical safety), REACH regulation concerning plastics, solders, and metal alloys, and labeling regarding heat dissipation and power.