MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.

Description of goods

GB113692971

Expired

8548901010- Related TARIC code

Issuing country

Date of issue

Dec 17, 2004

Valid from

Dec 17, 2004

Valid until

Dec 31, 2006

Place of issue

Southend

Description of goods

Classification justification

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF G.I.R.'S 1 AND 6, AS WELL AS THE TEXT OF HEADINGS 8548 AND 854890.

Keywords

AS MODULESASSEMBLED IN MODULESCMOS INTEGRATED CIRCUITSELECTRONIC CHIPSMEMORY CHIPS

GB113692971

Expired

8548901010- Related TARIC code

Issuing country

Date of issue

Dec 17, 2004

Valid from

Dec 17, 2004

Valid until

Dec 31, 2006

Place of issue

Southend

Description of goods

Classification justification

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF G.I.R.'S 1 AND 6, AS WELL AS THE TEXT OF HEADINGS 8548 AND 854890.

Keywords

AS MODULESASSEMBLED IN MODULESCMOS INTEGRATED CIRCUITSELECTRONIC CHIPSMEMORY CHIPS

MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.

See also