SILVER COPPER POWDERS IN SEMI-MANUFACTURED FORM. THE SILVER COPPER POWDER IS COMPOSED OF 99.99% PURE SILVER COVERING OVER THE COPPER POWDER PARTICLES. THE SILVER IS DIRECTLY DEPOSITED ON THE SURFACE OF THE COPPER IN PURE FORM. THE SILVER IS PHYSICALLY BONDED STRONGLY TO THE COPPER SURFACE, BUT CAN BE SEPARATED FROM EACHOTHER BY PHYSICAL MEANS AND PROVEN TO RETAIN THEIR INDIVIDUAL PURE FORMS. FOR ULTIMATE USE IN ELECTRONIC PACKAGING PRODUCTS SUCH AS ELECTRICALLY CONDUCTIVE GASKETS AND ELECTRICALLY CONDUCTIVE ADHESIVES.

CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:- GENERAL INTERPRETATIVE RULES (GIR) GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 7107 FOR BASE METALS CLAD WITH SILVER, NOT FURTHER WORKED THAN SEMI-MANUFACTURED ALSO CLASSIFIED IN ACCORDANCE WITH: NOTE 1(B), 4(A) AND 7 TO CHAPTER 71 HARMONISED SYSTEM EXPLANATORY NOTES (HSEN) GENERAL NOTE (2) TO CHAPTER 71 AND TO HEADING 7107