BTI GB122785078
Description of goods
COPPER BACKED ELECTRICAL INSULATING MATERIAL USED SOLEY IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS. THE INSULATING MATERIAL IS MADE UP AS FOLLOWS: CIRCUIT LAYER - MADE OF COPPER FOIL. THIS SURFACE IS PRINTED AND ETCHED AWAY TO PRODUCE THE CIRCUIT PATTERN. DIELECTRIC LAYER - THIS LAYER DRAWS THE HEAT OUT OF THE SURFACE LAYER AND DISTRIBUTES IT ACROSS THE BASE LAYER WHILST ISOLATING THE ELECTRIC CURRENT. BASE LAYER - THIS IS OF COPPER.