MOLYBDENUM DISCS USED IN THE ASSEMBLY OF OF POWER SEMI CONDUCTOR DIODES AND THYRISTORS AS THE SILICON WAFER SUBSTRATE

Description of goods

GB501916963

Expired

8541900000- Related TARIC code

Issuing country

Date of issue

Jun 20, 2014

Valid from

Jun 20, 2014

Valid until

Jun 19, 2020

Place of issue

Southend

Description of goods

MOLYBDENUM DISCS USED IN THE ASSEMBLY OF OF POWER SEMI CONDUCTOR DIODES AND THYRISTORS AS THE SILICON WAFER SUBSTRATE

Classification justification

CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:- GENERAL INTERPRETATIVE RULES (GIR)S GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 8541 - DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES; MOUNTED PIEZOELECTRIC CRYSTALS GIR 6 HAS BEEN USED TO CLASSIFY THE GOODS TO SUBHEADING LEVEL 854190 - PARTS

Keywords

DIODEMOLYBDENUM DISCSOF MOLYBDENUMSEMICONDUCTOR DEVICETHYRISTORS

GB501916963

Expired

8541900000- Related TARIC code

Issuing country

Date of issue

Jun 20, 2014

Valid from

Jun 20, 2014

Valid until

Jun 19, 2020

Place of issue

Southend

Description of goods

MOLYBDENUM DISCS USED IN THE ASSEMBLY OF OF POWER SEMI CONDUCTOR DIODES AND THYRISTORS AS THE SILICON WAFER SUBSTRATE

Classification justification

Keywords

DIODEMOLYBDENUM DISCSOF MOLYBDENUMSEMICONDUCTOR DEVICETHYRISTORS

MOLYBDENUM DISCS USED IN THE ASSEMBLY OF OF POWER SEMI CONDUCTOR DIODES AND THYRISTORS AS THE SILICON WAFER SUBSTRATE

See also