CHEMICAL MECHANICAL POLISHING MACHINE WHICH IS USED TO GRIND AND REMOVE THE MICROSCOPIC TOPOGRAPHIC FEATURES ON A WAFER. THE MACHINE THEN POLISHES THE WAFER.
CHEMICAL MECHANICAL POLISHING MACHINE WHICH IS USED TO GRIND AND REMOVE THE MICROSCOPIC TOPOGRAPHIC FEATURES ON A WAFER. THE MACHINE THEN POLISHES THE WAFER.
CHEMICAL MECHANICAL POLISHING MACHINE WHICH IS USED TO GRIND AND REMOVE THE MICROSCOPIC TOPOGRAPHIC FEATURES ON A WAFER. THE MACHINE THEN POLISHES THE WAFER.
Classification justification
CLASSIFICATION IS DETERMINED BY GENERAL INTERPRETATIVE RULES 1 AND 6; THE TEXT OF THE COMBINED NOMENCLATURE CODES 8464 AND 8464 20 05; THE HARMONISED SYSTEM EXPLANATORY NOTES TO HEADING 8464.