SELF ADHESIVE POLISHING DISC USED TO POLISH WAFERS AS PART OF THE MANUFACTURING PROCESS INVOLVED IN THE PRODUCTION OF SEMICONDUCTOR WAFERS. THE DISC CONCIST OF A POLYMER FORMULATION COATED ON TO A POLYESTER FILM SUBSTRATE LAYER.THE DISC IS SUPPLIED IN CIRCULAR SHAPES MEASURING 24" TO 36" IN DIAMETER.

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF THE GENERAL RULES 1 AND 6 FOR THE INTERPRETATION OF THE COMBINED NOMENCLATURE; THE TEXT OF CODES 3919, 3919 90 & 3919 90 70; THE HARMONISED SYSTEM EXPLANATORY NOTES TO HEADING 3919;