THE PRODUCT IS AN ELECTRONIC COMPONENT CALLED A SIP (SYSTEM-IN-PACKAGE) COMPONENT. THESE SIP COMPONENTS ARE COMPOSED OF COMMERCIAL MEMORIES STACKED VERTICALLY AND ENCASED IN A HARD PLASTIC COMPOUND. SUCH COMPONENTS ARE VERY ROBUST WHEN EXPOSED TO VIBRATIONS, SHOCKS AND TEMPERATURE CHANGES. THIS MAKES THEM SUITABLE FOR HARSH ENVIRONMENTS SUCH AS AEROSPACE AND SPACE. THESE SIP COMPONENTS USE COMMERCIAL SRAM, FLASH, MRAM, EEPROM, ...ETC STACKED VERTICALLY. THESE PRODUCTS CAN BE CONSIDERED AS MULTI-COMPONENT INTEGRATED CIRCUITS BECAUSE OF THEIR CONSTRUCTION FROM MULTIPLE MEMORY PARTS.

GENERAL RULES 1 & 6 NOTE 9(b)(iv) TO CHAPTER 85 TEXT TO CODES 8542,8542 32,8542 32 11 NOTE (IV) of the HSEN TO HEADING 8542