ARTICLES OF STONE, PLASTER, CEMENT, ASBESTOS, MICA OR SIMILAR MATERIALS > ARTICLES OF STONE, PLASTER, CEMENT, ASBESTOS, MICA OR SIMILAR MATERIALS > Millstones, grindstones, grinding wheels and the like, without frameworks, for grinding, sharpening, polishing, trueing or cutting, hand sharpening or polishing stones, and parts thereof, of natural stone, of agglomerated natural or artificial abrasives, or of ceramics, with or without parts of other materials
| Code | Description | Duty |
|---|---|---|
| 6804100000D | Millstones and grindstones for milling, grinding or pulping | 0.000 % |
| 6804210000 | Other millstones, grindstones, grinding wheels and the like | 1.700 % |
| 6804210000 | Of agglomerated synthetic or natural diamond | 1.700 % |
| 6804210020D | Discs -|of synthetic diamonds which are agglomerated with a metal alloy, ceramic alloy or plastic alloy, -|having a self-sharpening effect by constant release of the diamonds, -|suitable for abrasive cutting of wafers, -|whether or not containing a hole in the centre, -|whether or not on a support -|with a weight of not more than 377|g per piece and -|with an external diameter of not more than 206|mm | 1.700 % |
| D | Steel wire used for cropping and squaring semiconductors: -coated with diamond grains of 5µm or more, but not more than 55µm -wire diameter 23 µm or more but not more than 350 µm, -having a breaking strength of 11 N or more, but not more than 170 N | 1.700 % |
+12 sub-codes
| Discs -|of synthetic diamonds which are agglomerated with a metal alloy, ceramic alloy or plastic alloy, -|having a self-sharpening effect by constant release of the diamonds, -|suitable for abrasive cutting of wafers, -|whether or not containing a hole in the centre, -|whether or not on a support -|with a weight of not more than 377|g per piece and -|with an external diameter of not more than 206|mm |
| 1.700 % |
| 6804210040D | Steel wire used for cropping and squaring semiconductors: -coated with diamond grains of 5µm or more, but not more than 55µm -wire diameter 23 µm or more but not more than 350 µm, -having a breaking strength of 11 N or more, but not more than 170 N | 1.700 % |
| 6804210050D | Wheels suitable for grinding, rounding, polishing, aligning or cutting: -composed of metal base and agglomerated synthetic or natural diamonds, -whether or not containing a hole in the centre, -with an external diameter not more than 870 mm, for machines for the manufacture of semiconductor wafers | 1.700 % |
| 6804210090D | Other | 1.700 % |
| 6804220000 | Of other agglomerated abrasives or of ceramics | 0.000 % |
| 6804221200 | Of artificial abrasives, with binder | 0.000 % |
| 6804221200 | Of synthetic or artificial resin | 0.000 % |
| 6804221200D | Not reinforced | 0.000 % |
| 6804221800D | Reinforced | 0.000 % |
| 6804223000D | Of ceramics or silicates | 0.000 % |
| 6804225000D | Of other materials | 0.000 % |
| 6804229000D | Other | 0.000 % |
| 6804230000D | Of natural stone | 0.000 % |
| 6804300000D | Hand sharpening or polishing stones | 0.000 % |