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THIS IS A CIRCULATING WATER BATH USED TO MAINTAIN A SET TEMPERATURE IN THE SAMPLE CHAMBER OF A CHIRASCAN CIRCULAR DICHROISM SPECTROMETER. IT HAS A 9.5 CM DISPLAY AND TOUCH PAD CONTROL. A TWO SPEED PRESSURE PUMP WITH EXTERNAL CIRCULATION CAPABILITY. RS232 CONNECTIVITY. THIS ITEM INCLUDES BOTH THE DISPLAY SCREEN AND THE BATH ITSELF. CIRCULATING WATER BATHS REGULATE TEMPERATURE BETTER THAN NON-CIRCULATING WATER BATHS BECAUSE THE WATER WHIPS THROUGH THE RESERVOIR INSTEAD OF JUST HEATING OR COOLING FROM THE BOTTOM AND SIDES. AS THE WATER BATH CIRCULATES THE FLUID, IT MINIMIZES HOT OR COLD POCKETS WHICH OCCUR WITH OTHER WATER BATH PRODUCTS. CIRCULATING WATER BATHS ALLOW YOU TO MAINTAIN TEMPERATURES OF SAMPLES WITHIN THE RESERVOIR AS WELL AS EXTERNAL EQUIPMENT WITH THE CLOSED-LOOP FEATURE.

FREE STANDING MACHINE FOR COOLING AND DISPENSING CARBONATED FROZEN SOFT DRINKS. MIXES EXTERNALLY SUPPLIED CO2, WATER & SYRUP TO PROVIDE A BEVERAGE DISPENSED FROM TAPS AT FRONT OF MACHINE.

A 20 FOOT CSC PLATED BITUTAINER SHIPPING CONTAINER WITH PIPES IN THE BOTTOM FOR HEATING WITH BURNERS TO MELT THE BITUMEN. IT IS ADAPTED INTO A MELTING UNIT BY CUTTING A HOLE IN THE TOP TO MAKE A TRAP DOOR WHERE SOLID BITUMEN IS CONTAINED AND IS IMPORTED WITH AN ELECTIC HOIST AND GANTRY TO ENABLE PEOPLE TO EXTRACT THE MELTING BITUMEN FROM THE CONTAINER.

CHILLER UNIT. A HEATED FLUID CIRCULATOR USED IN THE TEMPERATURE REGULATION OF ETCH EQUIPMENT. THE HEAT ENERGY IS TRANSFERRED TO THE EQUIPMENT VIA A CLOSED LOOP, PUMPED PROCESS FLUID, CIRCUIT FROM THE UNIT.THE TEMPERATURE OF THE PROCESS FLUID IS MAINTAINED BY SOFTWARE CONTROLLED CARTRIDGE HEATERS OF APPROXIMATELY 7KW RATING. THE UNIT IS FITTED TO DEPOSITION AND ETCH EQUIPMENT USED IN THE SEMICONDUCTOR MANUFACTURING INDUSTRY.IT IS USED TO PROVIDE A COOLING MEDIUM WHICH EXTRACTS THE HEAT FROM PROCESS MODULES WHEN IN USE.

CHILLER UNIT. A REFRIGERATED FLUID CIRCULATOR USED IN THE TEMPERATURE REGULATION OF ETCH TOOLS.THE UNIT IS USED IN THE SEMICONDUCTOR MANUFACTURING INDUSTRY TO PROVIDE A COOLING MEDIUM WHICH EXTRACTS HEAT FROM PROCESS MODULES WHEN IN USE.HEAT ENERGY IS TRANSFERRED FROM THE EQUIPMENT VIA A CLOSED LOOP ,PUMPED PROCESS, FLUID CIRCUIT TO THE UNIT. PROCESS FLUID TEMPERATURES ARE IN THE OPERATING RANGE OF MINUS 30 CENTIRGADE TO PLUS 90 CENTIGRADE.