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A RECEPTACLE FOR RECEIVING AND STORING COINAGE. THE POWER REQUIRED TO OPERATE THE EQUIPMENT TO IDENTIFY THE COINS AND RELEASE THE DRINKS IS SUPPLIED WHEN THE MODULE IS CONNECTED TO THE HOT DRINK VENDING UNIT (NOT INCLUDED WITH THIS BTI). THE EQUIPMENT DOES NOT PROVIDE ANY CHANGE.

CARD DISPENSER: GOODS ARE PART OF A CARD DISPENSING GOODS-VENDING MACHINE. THEY DISPENSE PLASTIC TELEPHONE CARDS, PAPER DEBIT CARDS, BRAKE OPEN STYLE TICKET AND SCRATCH CARDS. THIS PART IS THE DISPENSING MECHANISM.

Een zogenoemde werkstukhouder met -volgens opgave- onder andere de volgende uiterlijke en technische kenmerken: - in de verschijningsvorm van een grijze ring; - wordt gebruikt voor het positioneren en het op de plek houden van een wafer tijdens het productieproces; - siliciumcarbide; - de ring heeft een buiten- en binnendiameter van respectievelijk 23,6 en 19,6 cm.

A contactless system for electronically granting access to a site or building. The reader is typically wall-mounted next to a building entrance such as door equipped with an electronic lock. The reader has only one Printed Circuit Board Assembly (PCBA) and on this board is both a Radio Frequency Identification (RFID) integrated circuit (for use with smart cards and key fobs) and a Bluetooth integrated circuit (for use with enabled smart phone, tablet or wearable), accompanied by other discrete active (e.g., IC, diodes & transistors) and passive components. The Bluetooth wireless communication sends data to an access controller via a hard wire (e.g., RS 232) connection. The readers are offered in two sizes in polycarbonate housing. Model 20 Contactless Reader 45 mm x 120 mm x 20 mm. Model 40 Contactless Reader 89 mm x 120 mm x 20 mm. Both have same product characteristics.

CLEAN KIT FOR SPUTTERING MACHINE. THE KIT IS COMPRISED OF THE FOLLOWING COMPONENTS: A LOWER SHIELD, INNER SHIELD, UPPER SHIELD, COVER RING, DEPOSITION RING, SHUTTER DISK, INNER SHIELD CLAMP AND LOWER SHIELD CLAMP. THE COMPONENTS ARE STACKED/INTERMESHED ON TOP OF EACH OTHER. THEY ENCAPSULATE THE SEMICONDUCTOR WAFER FROM THE WALLS OF THE HIGH VACUUM CHAMBER OF THE SPUTTERING MACHINE, ALLOWING CONTROLLED SPUTTERING TO TAKE PLACE AND PREVENTING METAL DEPOSITION ON THE CHAMBER WALLS. THE COMPONENTS ARE PRESENTED TOGETHER, UNASSEMBLED, IN A CASE.