GBBTI5037534648486200000
THIS SYSTEM IS CONFIGURED FOR ION BEAM ETCH (IBE) ONLY AND IS SUPPLIED WITH THE FOLLOWING CONFIGURATION;
STAINLESS STEEL PROCESS CHAMBER WITH EXCHANGEABLE LINERS SYSTEM CONSOLE WATER COOLED SUBSTRATE HOLDER AND HELIUM "BACKSIDE COOLING" COMPUTER CONTROL ION SOURCE / OPTICS VACUUM MEASUREMENT GAS SUPPLY PUMPING SYSTEM TRANSFER STATION VACUUM CASSETTE STATION SIMS. THE SYSTEM IS CONFIGURED TO PERFORM THE FOLLOWING PROCESSES: ETCHING OF SIO2, AU, CR, RU, TI, PT, CU, TIW, CO, AG, NI, TINI, TA, AL2O3, TAN, PD, CAF2, FE, MGO, PZT, IEMN, CUN, NIFE, CR2O3 & CMT AND IS CONFIGURED FOR THE ETCHING OF NEW TYPES OF SENSORS INCLUDING FORCE AND PRESSURE SENSORS.
FOR MEDICAL AND SCIENTIFIC APPLICATIONS.