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HANDLER FOR TRANSPORTING PRODUCTION WAFERS. THE HANDLER TRANSPORTS THE WAFERS TO AND FROM PRODUCTION MODULES, WHICH ARE FIXED TO THE HANDLER UNDER VACUUM CONDITIONS.IT IS PART OF HANDLER PLATFORM USED IN VOLUME PRODUCTION ORIENTED SYSTEMS IN THE SEMICONDUCTOR MANUFACTURING INDUSTRY.THE APPARATUS HAS A ROUGHLY TRIANGULAR, THREE WHEELED BASE FROM WHICH FOUR UPRIGHT POSTS SUPPORT THE WAFER HANDLING SECTION.

MACHINES AND APPARATUS SOLELY OF A KIND USED FOR THE ASSEMBLY AND HANDLING OF SEMICIONDUCTOR DEVICES (SOLAR MODULES OF 85414090), NAMELY LAMINATOR MACHINE. THIS WORKS AS FOLLOWS: FROM THE LAY UP MACHINE THE SOLAR MODULES ARE LOCATED ONTO THE LAMINATOR PRE-HEATED BED . AFTER SEVERAL MINUTES THE MODULES AUTOMATICALLY TRANSFER INTO THE MAIN LAMINATOR CHAMBER FOR A FURTHER PERIOD AFTER WHICH TIME THE ENTIRE STRUCTURE HAS BEEN LAMINATED TOGETHER PROVIDING A WATERPROOF SUBSTRATE.

MECHANICAL HANDLING SYSTEM USED TO TRANSPORT SEMICONDUCTOR DEVICES, SPECIFICALLY INTEGRATED CIRCUITS, FROM CONTAINERS INTO A TESTER AND THEREAFTER INTO ANOTHER CONTAINER. SUCH HANDLERS ARE USUALLY INTERFACED TO AN IC TESTER THEREBY AUTOMATING THE PROCESS. THIS HANDLING SYSTEM CAN ALSO CONTAIN A HEATING FACILITY TO RAISE THE TEMPERATURE OF THE INTEGRATED CIRCUITS IF REQUIRED.

CLEAN KIT FOR SPUTTERING MACHINE. THE KIT IS COMPRISED OF THE FOLLOWING COMPONENTS: A LOWER SHIELD, INNER SHIELD, UPPER SHIELD, COVER RING, DEPOSITION RING, SHUTTER DISK, INNER SHIELD CLAMP AND LOWER SHIELD CLAMP. THE COMPONENTS ARE STACKED/INTERMESHED ON TOP OF EACH OTHER. THEY ENCAPSULATE THE SEMICONDUCTOR WAFER FROM THE WALLS OF THE HIGH VACUUM CHAMBER OF THE SPUTTERING MACHINE, ALLOWING CONTROLLED SPUTTERING TO TAKE PLACE AND PREVENTING METAL DEPOSITION ON THE CHAMBER WALLS. THE COMPONENTS ARE PRESENTED TOGETHER, UNASSEMBLED, IN A CASE.

THIS SYSTEM IS CONFIGURED FOR ION BEAM ETCH (IBE) ONLY AND IS SUPPLIED WITH THE FOLLOWING CONFIGURATION; STAINLESS STEEL PROCESS CHAMBER WITH EXCHANGEABLE LINERS SYSTEM CONSOLE WATER COOLED SUBSTRATE HOLDER AND HELIUM "BACKSIDE COOLING" COMPUTER CONTROL ION SOURCE / OPTICS VACUUM MEASUREMENT GAS SUPPLY PUMPING SYSTEM TRANSFER STATION VACUUM CASSETTE STATION SIMS. THE SYSTEM IS CONFIGURED TO PERFORM THE FOLLOWING PROCESSES: ETCHING OF SIO2, AU, CR, RU, TI, PT, CU, TIW, CO, AG, NI, TINI, TA, AL2O3, TAN, PD, CAF2, FE, MGO, PZT, IEMN, CUN, NIFE, CR2O3 & CMT AND IS CONFIGURED FOR THE ETCHING OF NEW TYPES OF SENSORS INCLUDING FORCE AND PRESSURE SENSORS. FOR MEDICAL AND SCIENTIFIC APPLICATIONS.