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Een zogenoemde werkstukhouder met -volgens opgave- onder andere de volgende uiterlijke en technische kenmerken: - in de verschijningsvorm van een grijze ring; - wordt gebruikt voor het positioneren en het op de plek houden van een wafer tijdens het productieproces; - siliciumcarbide; - de ring heeft een buiten- en binnendiameter van respectievelijk 23,6 en 19,6 cm.

CLEAN KIT FOR SPUTTERING MACHINE. THE KIT IS COMPRISED OF THE FOLLOWING COMPONENTS: A LOWER SHIELD, INNER SHIELD, UPPER SHIELD, COVER RING, DEPOSITION RING, SHUTTER DISK, INNER SHIELD CLAMP AND LOWER SHIELD CLAMP. THE COMPONENTS ARE STACKED/INTERMESHED ON TOP OF EACH OTHER. THEY ENCAPSULATE THE SEMICONDUCTOR WAFER FROM THE WALLS OF THE HIGH VACUUM CHAMBER OF THE SPUTTERING MACHINE, ALLOWING CONTROLLED SPUTTERING TO TAKE PLACE AND PREVENTING METAL DEPOSITION ON THE CHAMBER WALLS. THE COMPONENTS ARE PRESENTED TOGETHER, UNASSEMBLED, IN A CASE.

PELLICLE. THIS PRODUCT IS USED IN THE SEMICONDUCTOR INDUSTRY TO PROTECT THE SURFACE OF A PHOTOMASK FROM LOOSE PARTICULATE. IT CONSISTS OF AN ANODISED ALUMINIUM FRAME WITH A SUBMICRON CELLULOSE OR FLUROPOLYMER MEMBRANE. IT IS ATTACHED TO THE PHOTOMASK WITH PRE-ADDITIVE ADHESIVE USING A PRESSURISED PELLICLE MOUNTING TOOL. THEY ARE IMPORTED PACKAGED IN BESPOKE TWO PART MOULDED CASES MADE FROM SOFT OR HARD PLASTIC.

PELLICLE. THIS PRODUCT IS USED IN THE SEMICONDUCTOR INDUSTRY TO PROTECT THE SURFACE OF A PHOTOMASK FROM LOOSE PARTICULATE. IT CONSISTS OF AN ANODISED ALUMINIUM FRAME WITH A SUBMICRON CELLULOSE OR FLUROPOLYMER MEMBRANE. IT IS ATTACHED TO THE PHOTOMASK WITH PRE-ADDITIVE ADHESIVE USING A PRESSURISED PELLICLE MOUNTING TOOL. THEY ARE IMPORTED PACKAGED IN BESPOKE TWO PART MOULDED CASES MADE FROM SOFT OR HARD PLASTIC.

AN AUTO FRONT OPENING SHIPPING BOX. IT IS A CLEAR PLASTIC MINI-ENVIRONMENT USED TO KEEP SEMICONDUCTOR WAFERS CLEAN AND SAFE WHEN THEY ARE SHIPPED OUTSIDE OF THE MANUFACTURING (FAB) ENVIRONMENT. THE FRONT OPENING SHIPPING BOX (FOSB) IS A SPECIALISED EXTERNAL TRANSPORT COMPONENT OF THE WAFER HANDLING PROCESS. IT CONTAINS MECHANISMS DESIGNED EXCLUSIVELY FOR USE BY WAFER HANDLING MACHINERY.