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PRODUCT IS USED IN THE MANUFACTURE OF SEMI CONDUCTOR WAFERS. WAFERS ARE INSTALLED INTO THE CASSETTE AFTER THE POLISHING PROCESS, THE CASSETTE IS THEN FIXED IN THE EQUIPMENT FOR INSPECTION AND CLEANING PROCESS. PRODUCT CONSISTS OF THE CASSETTE, A COVER, A COMB, A GASKET AND A POLYPROPYLENE BODY. AFTER INSPECTION AND CLEANING, COVER AND BODY ARE ATTACHED TO THE CASSETTE TO PREVENT WAFERS FROM CONTAMINATION AND THE COMB IS ATTACHED TO THE COVER TO PREVENT ANY DAMAGE FROM MOVING.

AN AUTO FRONT OPENING SHIPPING BOX. IT IS A CLEAR PLASTIC MINI-ENVIRONMENT USED TO KEEP SEMICONDUCTOR WAFERS CLEAN AND SAFE WHEN THEY ARE SHIPPED OUTSIDE OF THE MANUFACTURING (FAB) ENVIRONMENT. THE FRONT OPENING SHIPPING BOX (FOSB) IS A SPECIALISED EXTERNAL TRANSPORT COMPONENT OF THE WAFER HANDLING PROCESS. IT CONTAINS MECHANISMS DESIGNED EXCLUSIVELY FOR USE BY WAFER HANDLING MACHINERY.

CHAMBER SLEEVE FOR 4 INCH AND 6 INCH REACTOR. MADE OF QUARTZ. FITS INTO THE CHAMBER STRUCTURE WHICH ENCLOSES THE HEATER AND SHOWERHEAD WHERE THE GROWTH OF THE FILM ON THE WAFER TAKES PLACE. IT PROTECTS THE CHAMBER FROM GETTING COATED. SPECIFICALLY SHAPED AND CARRIES OUT A SPECIFIC FUNCTION WITHIN THE MACHINE AND CAN ONLY BE USED WITHIN THIS MACHINE. USED IN THE MANUFACTURE OF SEMICONDUCTOR DEVICES.

A REACTOR ROD. MADE OF MOLYBDENUM. IT FITS INTO THE HEATER STRUCTURE. RESISTANCE HEATED FURNACE/APPARATUS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES. THE ROD MECHANICALLY SUPPORTS THE HEATER AND PROVIDES ELECTRICAL POWER TO THE HEATER.

A 6 INCH HEATER ASSEMBLY. FITS INTO THE HEATER STRUCTURE. RESISTANCE HEATED FURNACE/APPARATUS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES. A COIL MADE OF GRAPHITE THAT BY PASSING AN ELECTRIC CURRENT THROUGH IT HEATS UP.