MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN A DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.

Description of goods

GB114195491

Expired

8548901090- Related TARIC code

Issuing country

Date of issue

May 23, 2005

Valid from

May 23, 2005

Valid until

Dec 31, 2006

Place of issue

Southend

Description of goods

Classification justification

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF G.I.R.'S 1 AND 6, AS WELL AS THE TEXT OF HEADINGS 8548 AND 854890.

Keywords

AS MODULESASSEMBLED IN MODULESCMOS INTEGRATED CIRCUITSELECTRONIC CHIPSMEMORY MODULES

GB114195491

Expired

8548901090- Related TARIC code

Issuing country

Date of issue

May 23, 2005

Valid from

May 23, 2005

Valid until

Dec 31, 2006

Place of issue

Southend

Description of goods

Classification justification

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF G.I.R.'S 1 AND 6, AS WELL AS THE TEXT OF HEADINGS 8548 AND 854890.

Keywords

AS MODULESASSEMBLED IN MODULESCMOS INTEGRATED CIRCUITSELECTRONIC CHIPSMEMORY MODULES

MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN A DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.

See also