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MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN A DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.

MEMORY MODULE. THE MEMORY MODULE IS FITTED WITH 512K X 8 SRAM ,5V CORE SUPPLY, THE MEMORY ADDRESS IS THE SAME AS THE ACCESS CONTROLLER.THIS CASE REPLACES CASE NUMBER 115159979 WHICH HAS BEEN CANCELLED FOLLOWING THE 2007 CODE CHANGE.

The memory module is fitted with 512Kx8 SRAM, 5v core supply, the memory address is same as the access controller.

8Mx16 JEDEC STANDARD SDRAM WITH 1,8V CORE SUPPLY, FOUR BANKS, LOW POWER, 104 MHz.. SDRAM MEMORY MODULE MANUFACTURED USING MOS AND CMOS PROCESS TECHNOLOGY.

MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.