COPPER TUNGSTEN (CUW) HEATSINK OF 84.3 PERCENT TUNGSTEN, 10.4 PERCENT COPPER, 2.8 PERCENT AUSN, 2.2 PERCENT NICKEL AND 0.3 PERCENT PLATINUM. THE CUSTOMER SOLDERS A GAAS SEMICONDUCTOR CHIP ONTO THE TOP. THE AUSN LAYER IN THE SOLDER IS USED FOR CHIP MOUNTING AT APPROX 300 DEGREE CELCIUS. THE APPLICATION OF THIS IS AS A LASER HEATSINK COMPONENT IN A VARIETY OF MEDICAL, SPACE AND COMMUNICATION MACHINES.

CLASSIFICATION IS DETERMINED BY GIRS 1 AND 6. CN CODE 81019990 OTHER THAN BARS AND RODS. HSEN XV-8101-2 REFERS.