SELF ADHESIVE POLISHING DISC USED TO POLISH WAFERS AS PART OF THE MANUFACTURING PROCESS INVOLVED IN THE PRODUCTION OF SEMICONDUCTOR WAFERS. THE DISC CONSISTS OF A MICRO POROUS POLYMER POLISH LAYER BONDED TO A POLYURETHANE IMPREGNATED FELT PAD AND IS SUPPLIED IN CIRCULAR SHAPES MEASURING 24" TO 36" IN DIAMETER.

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF THE GENERAL RULES 1 AND 6 FOR THE INTERPRETATION OF THE COMBINED NOMENCLATURE; THE TEXT OF CODES 5911, 5911 90 & 5911 90 90 90; THE HARMONISED SYSTEM EXPLANATORY NOTES TO HEADING 5911; NOTE 7 (a) TO SECTION XI, NOTE 1 (e) TO SECTION XVI, NOTE 7 (b) TO CHAPTER 59.