POLYESTER - FELT SUBSTRATE BASED WAFER POLISHING PAD IMPREGNATED WITH POLYURETHANE USED IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING.

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF THE GENERAL RULES 1 AND 6 FOR THE INTERPRETATION OF THE COMBINED NOMENCLATURE; THE TEXT OF CODES 5911, 5911 90 & 5911 90 90 40; THE HARMONISED SYSTEM EXPLANATORY NOTES TO HEADING 5911;