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OverviewTARIC NomenclatureClassification GuideBTIEU Classification RulingsCJEU Case Law - Tariff ClassificationMarket IntelligenceOrigin of GoodsExport ControlCBAM CalculatorEUDR CheckerClassifyAI SHCustoms ValueIncoterms® 2020
Overview

Tariff Classification

TARIC Nomenclature
Classification Guide
BTI
EU Classification Rulings
CJEU Case Law - Tariff Classification
Market Intelligence

Origin of Goods

Origin of Goods
Origin guides

Export control

Export Control

Environmental

CBAM Calculator
EUDR Checker

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ClassifyAI SH/TARIC
Customs Value
Incoterms® 2020
ClassifyAI SH/TARIC

Automated tariff classification with GRI justification

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Binding Tariff Information (BTI)

See also

IE14NT-14-2760-015911909040

POLYESTER - FELT SUBSTRATE BASED WAFER POLISHING PAD IMPREGNATED WITH POLYURETHANE USED IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING.

IE14NT-14-2760-025911909040

POLYESTER - FELT SUBSTRATE BASED WAFER POLISHING PAD IMPREGNATED WITH POLYURETHANE USED IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING.

IE14NT-14-2760-035911909040

POLYESTER - FELT SUBSTRATE BASED WAFER POLISHING PAD IMPREGNATED WITH POLYURETHANE USED IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING.

IE14NT-14-2760-045911909040

"CMP,PAD,XDBJ 4540 NO WDW" VPN 10373515 - SAMPLE SUPPLIED 4540 EMBOSSED POLYESTER - FELT SUBSTRATE BASED WAFER POLISHING PAD IMPREGNATED WITH POLYURETHANE USED IN CMP PROCESS OF SEMICONDUCTOR MANUFACTURING

IE11NT-14-973-025911909040

MULTI-LAYERED NON-WOVEN POLYESTER POLISHING PAD, IMPREGNATED WITH POLYURETHANE. THE POLISHING PAD IS GENERALLY USED FOR POLISHING WAFERS.

TARIC Nomenclature

25 000+ codes

Classification Guide

1 095 HS4

BTI

1 000 000+ BTI