0 results for "7107"
PRODUCT NAME: TPO APPLICATION: PHOTOINITIATOR FOR USE IN COATINGS, INKS COMPOSITION: DIPHENYL (2,4,6-TRIMETHYLBENZOYL) PHOSPHATE OXIDE CAS NO. 75980-60-8 EC NO. 278-355-8 >99% 2,4,6-TRIMETHYLBENZOIC ACID CAS NO. 480-63-7 EC NO. 207-553-9 <1% 2,4,6-TRIMETHYLBENZOIC IS AN UNREACTED STARTING MATERIAL IN SOLID FORM WHITE COLOUR
SILVER NICKEL POWDERS IN SEMI-MANUFACTURED FORM. PRODUCT CONSISTS OF A 99.99% PURE SILVER COVERING OVER BASE NICKEL POWDERS. THE PRODUCT IS NOT AN ALLOY, AS THE SILVER IS DIRECTLY DEPOSITED UPON THE NICKEL SURFACE IN PURE FORM. FOR ULTIMATE USE IN ELECTRONIC PACKAGING PRODUCTS, SUCH AS ELECTRICALLY CONDUCTIVE GASKETS AND ELECTRICALLY CONDUCTIVE ADHESIVES.
SILVER ALUMINIUM POWDERS IN SEMI-MANUFACTURED FORM. THE SILVER ALUMINIUM POWDER IS COMPOSED OF 99.99% PURE SILVER COVERING THE ALUMINIUM POWDER PARTICLES. THE SILVER IS DIRECTLY DEPOSITED ON THE SURFACE OF THE ALUMINIUM IN PURE FORM. THE SILVER IS PHYSICALLY BONDED STRONGLY TO THE ALUMINIUM SURFACE, BUT CAN BE SEPARATED FROM EACH OTHER BY PHYSICAL MEANS AND PROVEN TO RETAIN THEIR ORIGINAL PURE FORMS. FOR ULITMATE USE IN ELECTRONIC PACKAGING PRODUCTS SUCH AS ELECTRICALLY CONDUCTIVE GASKETS AND ELECTRICALLY CONDUCTIVE ADHESIVES.
SILVER COPPER POWDERS IN SEMI-MANUFACTURED FORM. THE SILVER COPPER POWDER IS COMPOSED OF 99.99% PURE SILVER COVERING OVER THE COPPER POWDER PARTICLES. THE SILVER IS DIRECTLY DEPOSITED ON THE SURFACE OF THE COPPER IN PURE FORM. THE SILVER IS PHYSICALLY BONDED STRONGLY TO THE COPPER SURFACE, BUT CAN BE SEPARATED FROM EACHOTHER BY PHYSICAL MEANS AND PROVEN TO RETAIN THEIR INDIVIDUAL PURE FORMS. FOR ULTIMATE USE IN ELECTRONIC PACKAGING PRODUCTS SUCH AS ELECTRICALLY CONDUCTIVE GASKETS AND ELECTRICALLY CONDUCTIVE ADHESIVES.
A BI-METAL STRIP OF SILVER OR SILVER ALLOY OF BETWEEN 3 TO 9 PERCENT AND REFINED COPPER, JOINED/INLAID BY A COLD BONDING PROCESS. THE STRIP IS PRESENTED IN COILS OF A THICKNESS BETWEEN 0.4 MM AND 1.5 MM AND OF A WIDTH BETWEEN 10 MM TO 75 MM. IT IS INTENDED FOR USE IN ELECTRICAL SWITCHES.