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DIODES THAT INCORPORATE A CRYSTAL OSCILLATOR THAT ARE LOW JITTER, AND HAS QUARTZ CRYSTAL RESONATOR TECHNOLOGY, WHICH ALSO INCORPORATE CLOCK INTEGRATED CIRCUIT TECHNOLOGY. THIS DEVICE IS AVAILABLE WITH COMPLEMENTARY METAL OXIDE SEMICONDUCTOR/TRANSISTOR-TRANSISTOR LOGIC, LOW VOLTAGE POSITIVE EMITTER COUPLED LOGICL, OR LOW VOLTAGE DIFFERENTIAL SIGNALLING OUTPUT LOGIC. THE DEVISE CAN BE USED FOR A VARIETY OF APPLICATIONS, INCLUDING WIFI, WIMAX, PASSIVE OPTICAL NETWORK AND TELECOMMUNICATION SYSTEMS LIKE SYNCHRONOUS OPTICAL NETWORKING/SYNCHRONOUS DIGITAL HIERARCHY. THE DIODE/PERICOM CRYSTAL CLOCK OSCILLATOR COMPRISE A PIEZOELECTRIC CRYSTAL AND A SILICON BASED INTEGRATED CIRCUIT WHICH FUNCTIONS AS A RESONATOR. ALL COMPONENTS ARE PACKAGED IN A CERAMIC HOUSING.

AN INTEGRATED CIRCUIT WHICH HAS THE FUNCTION OF A FIELD PROGRAMMABLE GATE ARRAY. THE FIELD PROGRAMMABLE GATE ARRAY IS A SEMICONDUCTOR DEVICE CONSISTING OF A MATRIX OF CONFIGURABLE LOGIC BLOCKS CONNECTED THROUGH PROGRAMMABLE INTERCONNECTS. THIS DEVICE HAS MORE THAN ONE SILICON ELEMENT. COMBINED IN A SINGLE LEAD FRAME.

THE PRODUCT IS AN ELECTRONIC COMPONENT CALLED A SIP (SYSTEM-IN-PACKAGE) COMPONENT. THESE SIP COMPONENTS ARE COMPOSED OF COMMERCIAL MEMORIES STACKED VERTICALLY AND ENCASED IN A HARD PLASTIC COMPOUND. SUCH COMPONENTS ARE VERY ROBUST WHEN EXPOSED TO VIBRATIONS, SHOCKS AND TEMPERATURE CHANGES. THIS MAKES THEM SUITABLE FOR HARSH ENVIRONMENTS SUCH AS AEROSPACE AND SPACE. THESE SIP COMPONENTS USE COMMERCIAL SRAM, FLASH, MRAM, EEPROM, ...ETC STACKED VERTICALLY. THESE PRODUCTS CAN BE CONSIDERED AS MULTI-COMPONENT INTEGRATED CIRCUITS BECAUSE OF THEIR CONSTRUCTION FROM MULTIPLE MEMORY PARTS.

A FULL BRIDGE DRIVE INTEGRATED CIRCUIT COMPRISING A FULL BRIDGE CONTROLLER MONOLITHIC INTEGRATED CIRCUIT AND SEPARATE POWER INSULATED-GATE BIPOLAR TRANSISTOR. ENCAPSULATED IN A MOULDED PACKAGE. IT CANNOT BE DIRECTLY INCORPORATED INTO AN AUTOMOBILE OR OTHER APPLICATIONS WITHOUT FURTHER PROCESSING USED AS A COMPONENT THAT WILL BE USED TO MAKE HIGH DENSITY DISCHARGE (HID) HEADLAMPS IN THE AUTOMOTIVE INDUSTRY.

AN INTEGRATED CIRCUIT CHIP CONTAINING A MICROPROCESSOR (SPARC) AND ASSOCIATED FUNCTIONS (E.G NETWORK, MEMORY CONTROLLER ETC.) THIS CHIP IS A HIGH RELIABILITY CHIP USED IN THE SPACE AND AEROSPACE INDUSTRIES. THE PRODUCT IS CONSIDERED TO BE A MULTI-COMPONENT INTEGRATED CIRCUIT (MCO) MEMORY.