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THE PRODUCT IS AN ELECTRONIC COMPONENT CALLED A SIP (SYSTEM-IN-PACKAGE) COMPONENT. THESE SIP COMPONENTS ARE COMPOSED OF COMMERCIAL MEMORIES STACKED VERTICALLY AND ENCASED IN A HARD PLASTIC COMPOUND. SUCH COMPONENTS ARE VERY ROBUST WHEN EXPOSED TO VIBRATIONS, SHOCKS AND TEMPERATURE CHANGES. THIS MAKES THEM SUITABLE FOR HARSH ENVIRONMENTS SUCH AS AEROSPACE AND SPACE. THESE SIP COMPONENTS USE COMMERCIAL SRAM, FLASH, MRAM, EEPROM, ...ETC STACKED VERTICALLY. THESE PRODUCTS CAN BE CONSIDERED AS MULTI-COMPONENT INTEGRATED CIRCUITS BECAUSE OF THEIR CONSTRUCTION FROM MULTIPLE MEMORY PARTS.

A FULL BRIDGE DRIVE INTEGRATED CIRCUIT COMPRISING A FULL BRIDGE CONTROLLER MONOLITHIC INTEGRATED CIRCUIT AND SEPARATE POWER INSULATED-GATE BIPOLAR TRANSISTOR. ENCAPSULATED IN A MOULDED PACKAGE. IT CANNOT BE DIRECTLY INCORPORATED INTO AN AUTOMOBILE OR OTHER APPLICATIONS WITHOUT FURTHER PROCESSING USED AS A COMPONENT THAT WILL BE USED TO MAKE HIGH DENSITY DISCHARGE (HID) HEADLAMPS IN THE AUTOMOTIVE INDUSTRY.

AN INTEGRATED CIRCUIT CHIP CONTAINING A MICROPROCESSOR (SPARC) AND ASSOCIATED FUNCTIONS (E.G NETWORK, MEMORY CONTROLLER ETC.) THIS CHIP IS A HIGH RELIABILITY CHIP USED IN THE SPACE AND AEROSPACE INDUSTRIES. THE PRODUCT IS CONSIDERED TO BE A MULTI-COMPONENT INTEGRATED CIRCUIT (MCO) MEMORY.

MICROPROCESSORS IN THE FORM OF AN INTEGRATED CIRCUIT OF MOS TECHNOLOGY. MULTI-CHIP INTEGRATED CIRCUIT CONSISTING OF TWO OR MORE INTERCONNECTED MONOLITHIC INTEGRATED CIRCUITS

16 BIT A/D CONVERTER INTEGRATED CIRCUIT. IN A 48 PIN QFD (QUAD FLAT NO LEADS) PACKAGE. APPROX 8 X 8 MM. DESIGNED FOR DIGITISING HIGH FREQUENCY, WIDE DYNAMIC RANGE SIGNALS UP TO INPUT FREQUENCIES OF 700 MHz.