A THICK FILM PASTE FOR USE IN THE ELECTRONICS INDUSTRY. THE PASTE IS DEPOSITED ONTO A FLAT SUBSTRATE (USUALLY ALUMINA OR STEEL), DRIED AND FIRED IN A FURNACE TO CREATE AN ELECTRONIC CIRCUIT. THE PASTE IS MANUFACTURED IN BATCHES, CHEMICALS ARE COMBINED IN A MIXING VESSEL, MIXED AND MILLED IN A TRIPLE ROLL MILL. EACH BATCH IS TESTED FOR ITS ELECTRONIC PROPERTIES AND ITS PHYSICAL CHARACTERISTICS. THE PASTE IS SOLD IN POTS TO MANUFACTURERS OF ELECTRONIC CIRCUITRY.

CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:- GENERAL INTERPRETATIVE RULES (GIR)S:- GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 3207 FOR PREPARED PIGMENTS, PREPARED OPACIFIERS AND PREPARED COLOURS, VITRIFIABLE ENAMELS AND GLAZES, ENGOBES (SLIPS), LIQUID LUSTRES AND SIMILAR PREPARATIONS. GIR 6 HAS BEEN USED TO CLASSIFY THE GOODS TO SUBHEADING LEVEL 320730 FOR LIQUID LUSTRES AND SIMILAR PREPARATIONS. TARIC 3207300090 FOR OTHER THAN THE SPECIFIC RECIPE COVERED BY HEADING 3207300010 NOTE 1 (a) TO CHAPTER 32 REFERS. EXCLUDED FROM 3818009000 AS PRODUCT DOES NOT MEET THE TERMS OF THE HEADING AS EITHER A CHEMICAL ELEMENT OR A CHEMICAL COMPOUND DOPED FOR USE IN ELECTRONICS. HSENS TO CHAPTER 3818 REFER.