BTI GB502241114
Description of goods
REGULAR FLUX PASTE. A WATER SOLUBLE PASTE FOR COPPER SOLDERING. MANUFACTURING PROCESS : THE INDIVIDUAL CHEMICALS ARE MEASURED PRECISELY AND MIXED AS A BATCH BY AN AUTOMATED PROCESS IN VATS BEFORE BEING PIPED INTO THE PACKING AREA, WHERE THE INDIVIDUAL POT SIZES ARE FILLED AUTOMATICALLY WITH RELEVANT QUANTITY OF FLUX ON THE PRODUCTION LINE AND SEALED WITH A LID, BEFORE BEING BOXED FOR SHIPPING. PASTE DOES NOT CONTAIN TIN, SILVER, COPPER, BISMUTH, ZINC OR INDIUM. NOT CONSIDERED TO BE A PICKLING PREPARATION. PH NEUTRAL AND NON-ACID AND A WATER SOLUABLE PRODUCT TO ALLOW THE SMOOTH RUNNING OF THE SOLDER.