BTI GBBTI504782351
Description of goods
RESIN SEALANT PASTE SEALANT PASTE PUT UP IN CARTRIDGES FOR USE IN THE ELECTRONICS INDUSTRY FOR FILLING HOLES IN MULTI LAYER PRINTED CIRCUIT BOARDS. EMPLOYED IN THE PREVENTION OF SHORT CIRCUITS IN SUCH BOARDS. PRODUCTION PROCESS:- ONCE THE PRINTED CIRCUIT BOARD HAS BEEN INSERTED INTO A SO-CALLED PLUGGING MACHINE, A VACUUM IS CREATED AFTER ABOUT 15 SECONDS. THE FILLING PROCESS STARTS WHEN A PISTON PRESSES THE PASTE OUT OF A CARTRIDGE INTO THE HOLES, AS THE FILL HEADS MOVE ACROSS THE PRINTED CIRCUIT BOARD CONSTITUENTS:- CALCIUM CARBONATE (CAS: 1317-65-3), BISPHENOL A EPICHLOROHYDRIN (CAS: 25068-38-6), EPOXY RESIN F-44 FORMALDEHYDE POLYMER WITH CHLOROMETHYLOXIRANE AND PHENOL (CAS: 9003-36-5), BARIUM SULPHATE (CAS: 7727-43-7), SILICON DIOXIDE (CAS: 7631-86-9), 2,4-DIAMINO-6-[2-(2-METHYL-1-IMIDAZOLYL)ETHYL]-1,3,5-TRIAZINE (CAS: 38668-46-1), KAOLIN, CALCINED (CAS: 92704-41-1), 4-TERT-BUTYLPHENYL GLYCIDYL ETHER (CAS: 3101-60-8), POLY(DIMETHYLSILOXANE) (CAS: 63148-62-9).