MULTICOMBINATIONAL FIFO (FIRST IN FIRST OUT) MEMORY MODULES, USING VARIATIONS OF METAL OXIDE SEMICONDUCTOR (MOS) PROCESS TECHNOLOGY. USED IN DATA COMMUNICATIONS ENVIROMENT, TO PROVIDE WIDTH EXPANSION, DEPTH EXPANSION, BUS-MATCHING AND DATA SORTING.

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF G.I.R.'S 1 AND 6, AS WELL AS THE TEXT OF HEADINGS 8548 AND 854890.