PLATINUM (Pt) SPUTTERING TARGET FOR USE IN HIGH VACUUM DEPOSITION PROCESS. THE PROCESS IS DESIGNED TO PUT DOWN A FINE LAYER OF Pt ON A SUBSTRATE SURFACE.
PLATINUM (Pt) SPUTTERING TARGET FOR USE IN HIGH VACUUM DEPOSITION PROCESS. THE PROCESS IS DESIGNED TO PUT DOWN A FINE LAYER OF Pt ON A SUBSTRATE SURFACE.
PLATINUM (Pt) SPUTTERING TARGET FOR USE IN HIGH VACUUM DEPOSITION PROCESS. THE PROCESS IS DESIGNED TO PUT DOWN A FINE LAYER OF Pt ON A SUBSTRATE SURFACE.
Justification du classement
CLASSIFICATION IS DETERMINED ACCORDING TO GIRS 1 AND 6. CN CODE 711019 10 FOR PLATINUM, OTHER, PLATES. HSENS TO CHAPTER 7110 REFER.