ALUMINIUM BONDING WIRE MADE UP OF 99% ALUMINIUM BONDING WIRE AND 1% SILICON.
IT IS SUPPLIED ON SPOOLS, AND NOT INSULATED. THE WIRE IS USED IN THE MANUFACTURE OF SEMICONDUCTOR PRODUCTS.
ALUMINIUM BONDING WIRE MADE UP OF 99% ALUMINIUM BONDING WIRE AND 1% SILICON.
IT IS SUPPLIED ON SPOOLS, AND NOT INSULATED. THE WIRE IS USED IN THE MANUFACTURE OF SEMICONDUCTOR PRODUCTS.
ALUMINIUM BONDING WIRE MADE UP OF 99% ALUMINIUM BONDING WIRE AND 1% SILICON.
IT IS SUPPLIED ON SPOOLS, AND NOT INSULATED. THE WIRE IS USED IN THE MANUFACTURE OF SEMICONDUCTOR PRODUCTS.
Justification du classement
CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:-
GENERAL INTERPRETATIVE RULES (GIR)S
GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 7605 - ALUMINIUM WIRE
GIR 6 HAS BEEN USED TO CLASSIFY THE GOODS TO SUBHEADING LEVEL 760519 - ALUMINIUM NOT ALLOYED
TARIC CODE 7605190090 - OTHER
ALSO CLASSIFIED IN ACCORDANCE WITH
HSENS TO CHAPTER 76, NOTE 1(C)
NOTE 2A TO CHAPTER 85
Mots-clés
FOR SEMICONDUCTOR DEVICESNOT INSULATEDOF ALUMINIUMOF SILICONWIRE