AN ELECTRICALLY AND THERMALLY CONDUCTIVE SEMICONDUCTOR GRADE ADHESIVE. THIS STRESS ABSORBING SILVER FILLED EPOXY IS DESIGNED FOR BONDING CHIPS TO SUBSTRATES WITH A MISMATCH IN COEFFICIENT OF THERMAL EXPANSION. FOR INDUSTRIAL USE ONLY.

CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:- GENERAL INTERPRETATIVE RULES (GIR)S:- GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 3506 PREPARED GLUES AND OTHER PREPARED ADHESIVES, NOT ELSEWHERE SPECIFIED OR INCLUDED; PRODUCTS SUITABLE FOR USE AS GLUES OR ADHESIVES, PUT UP FOR RETAIL SALE AS GLUES OR ADHESIVES, NOT EXCEEDING A NET WEIGHT OF 1 KG. GIR 5B HAS BEEN USED TO IDENTIFY THE TYPE OF PACKAGING. GIR 6 HAS BEEN USED TO CLASSIFY THE GOODS TO SUBHEADING LEVEL 350691 OTHER THAN PRODUCTS SUITABLE FOR USE AS GLUES OR ADHESIVES, PUT UP FOR RETAIL SALE AS GLUES OR ADHESIVES, NOT EXCEEDING A NET WEIGHT OF 1 KG. CN CODE 35069100 ADHESIVES BASED ON POLYMERS OF HEADINGS 3901 TO 3913 OR ON RUBBER. TARIC CODE 3506910090 OTHER. ALSO CLASSIFIED IN ACCORDANCE WITH:- SECTION VI GENERAL NOTE 2. SECTION VI NOTE 2. HSEN TO HEADING 3506.