ALLOY WAFER LAPPED, SLICED, COATED AND POLISHED. FOR SPECIFIC USE IN PHOTOSENSITIVE (HIGH BRIGHTNESS LED) SEMICONDUCTOR DEVICES. THE WAFER IS ONLY COATED ON ONE SIDE. THE BACKSIDE IS LEFT AS POLISHED. THE WAFER IS NOT SUBJECT TO MASKING OR PATTERN GENERATING AT THE TIME OF IMPORT. DIMENSIONS: 150MM DIAMETER X 650 MICRONS THICKNESS.

CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:- GENERAL INTERPRETATIVE RULES (GIR)S GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 8541 - DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES, INCLUDING PHOTOVOLTAIC CELLS WHETHER OR NOT ASSEMBLED IN MODULES OR MADE UP INTO PANELS; LIGHT-EMITTING DIODES; MOUNTED PIEZOELECTRIC CRYSTALS GIR 6 HAS BEEN USED TO CLASSIFY THE GOODS TO SUBHEADING LEVEL 854190 - PARTS TRIBUNAL RULING TC/2015/05509 REFERS