AN ELECTRONIC COMPONENT CALLED A SIP (SYSTEM IN PACKAGE) COMPONENT. SIP COMPONENTS ARE COMPOSED OF COMMERCIAL MEMORIES STACKED VERTICALLY AND ENCASED IN A HARD PLASTIC COMPOUND. THE PRODUCT IS CONSIDERED TO BE A PROCESSOR OR CONTROLLER.

CLASSIFICATION IS DETERMINED BY THE PROVISIONS OF THE GENERAL RULES 1 AND 6 FOR THE INTERPRETATION OF THE COMBINED NOMENCLATURE; THE TEXT OF CODES 8542, 8542 31, 8542 31 00; THE HARMONISED SYSTEM EXPLANATORY NOTES TO HEADING 8542; NOTE 9 (B) (1) TO CHAPTER 85;