SPUTTERING/THERMAL DEPOSITION SYSTEM. IN THE FORM OF A MODULAR MACHINE SYSTEM CONSISTING OF VACUUM COATING CHAMBERS, VACUUM PUMPS, OPTIONAL LOCK CHAMBER AND SUBSTRATE TRANSFER HANDLING SYSTEM WITH SUBSTRATE AND TARGET HOLDERS. IT HAS THERMAL OR ELECTRON BEAM EVAPORATION WITH ALTERNATING CURRENT OR DIRECT CURRENT GENERATOR OR MAGNETRON SPUTTERING PLASMA SOURCES WITH HIGH FREQUENCY AND/OR DIRECT CURRENT GENERATOR. THERE IS AN OPTIONAL HEATING DEVICE, PROCESS GAS SUPPLY AND DISTRIBUTION SYSTEM FOR ASSEMBLY AND SYSTEM CONTROL. USED PREDOMINANTLY FOR THE GENERATION OF DEFINED THIN LAYERS ON SEMICONDUCTOR WAFERS OR SUBSTRATES BY DEPOSITION OF METALS, ALLOYS, ORGANICS, DIELECTRIC COMPOUNDS OR MIXTURES IN ULTRA/HIGH VACUUM BY THE PVD METHOD.

CLASSIFICATION HAS BEEN DETERMINED IN ACCORDANCE WITH THE FOLLOWING:- GENERAL INTERPRETATIVE RULES (GIR)S: GIR 1 HAS BEEN USED TO CLASSIFY THIS PRODUCT BY THE TERMS OF HEADING 8486 MACHINES AND APPARATUS OF A KIND USED SOLELY OR PRINCIPALLY FOR THE MANUFACTURE OF SEMICONDUCTOR BOULES OR WAFERS, SEMICONDUCTOR DEVICES, ELECTRONIC INTEGRATED CIRCUITS OR FLAT PANEL DISPLAYS; MACHINES AND APPARATUS SPECIFIED IN NOTE 9(C) TO THIS CHAPTER; PARTS AND ACCESSORIES GIR 6 HAS BEEN USED TO CLASSIFY THE GOODS TO SUBHEADING LEVEL 848620 MACHINES AND APPARATUS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES OR OF ELECTRONIC INTEGRATED CIRCUITS ALSO CLASSIFIED IN ACCORDANCE WITH: HSEN'S TO 8486 NOTE (B) (1) (C) REFERS